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BGA Reballing CGA Attach Configurable for other plating solutions Flexible rack plating system supports plating of leadframes and other electronic components Lead Attach / Component Preparation Pre-plated RoHs frames Robotic Hot Solder Dip & Exchange SnPb, Matte Sn, and Ni Plating Solder dip options Trim & Form and Reconditioning

• Tape & Reel
• 3D Scanning
• Bake and Package
• Marking & Labeling / Kitting

We will collect, sort, recycle, and dispose of electronic waste. Our primary goal is to properly destroy private data with the intent or repurposing salvageable electronics with the aim of protecting the environment. We cater to the customer needs. We specialize in the safe disposal with full data protection of medical, telecom equipment and electronic components and sub-assemblies and much more. We accept all types of electronic waste that you want to get rid of. Read more

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Assembly Services CSP/Plastic Assembly Automated saw, die attach and wire bond equipment Custom assembly solutions Epoxy die attach Flexible manufacturing space supporting a range of volumes Full automold and semi-automated mold equipment Gold ball bond Leadframe options including: design/replication, pre-plated, spot plated Qualification services available Custom Packaging Open Cavity Packaging Final Test Hermetic Assembly Automated and semi-automated assembly equipment Commercial and Military flows DLA certified Eutectic, Silver Glass and Epoxy Die Attach Flexible equipment to handle mix of package types Frit, Solder Seal and Metal Can Sealing In-house reliability testing Package replications including leadframes Qualification services available Multi-Chip Modules

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Screening Screening MIL-STD-750 Screening MIL-STD-751 Screening MIL-STD-883 Screening of 2000+ pin counts Screening of CPLD Screening of FPGA Screening of PLD Screening, Reliability and Qualification of ASIC Devices Screening, Reliability and Qualification of COTS Devices Screening, Reliability and Qualification of FPGA Devices Up-screening

Burn-in test Customized Flows and Qualification Plans Device Characterization HAST/THB Testing - Atmospheric and Humidity Tests Preconditioning and Moisture Sensitivity testing Rapid Temp Cycle and Thermal Shock testing Reverse Engineering

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HI-REL Tinning Services

Die inspection Die pick and place Wafer AC parameters Wafer Anti-counterfeit validation Wafer Application specific I/O test Wafer back-side grind Wafer bumping Wafer Data sheet verification Wafer DC parameters Wafer dicing Wafer grinding Wafer Known Good Die Wafer Lot Radiation Screening, Characterization, and Qualification Wafer saw Wafer Speed Binning Wafer Temperature Binning Wafer Testing Wafer - Function Tests Wafer “in family” data segregation Waffle/Gel Pack sorting