Program Sustainment Management

• OEM & EMS Asset/Excess Inventory Recovery
• Supplier/Manufacture Managed Inventory
  • Obsolescence Management
  • Excess Inventory Management

Sourcing

• Strategic component Sourcing
• Factor-Direct Authorized Fulfillment 
• Sourcing quality obsolete and hard to find electronic components
• Mitigate Shortages

Inventory Management 

• Bonding Programs
• BOM Monitoring, Analysis & Reporting
  • Product Lifecycle Management
• Inventory Management Warehousing 

Support Sales Program

• Customer-Focused Teams
• Third-party Logistics
• Order History
• Quick Turn Services

Cost-reduction 

PPV Balancing 

Wafer Test

Authentication Testing/Counterfeit Mitigation

• External Visual Inspection
• Mark Permanency
• Acetone Testing
• Methyl/Pyrrolidone Testing
• Dynasolve 750 Testing
• Decapsulation
• X-Ray Analysis
• Surface Texture Analysis
• HTT 
• XRF

Accelerated Life Testing

• Hermeticity Testing

Electrical Testing Services

• AC&DC Parametric Tests
• DDR Memory Testing
• Extended MLCC Testing Services
• JTAG and Boundary Scan
• Transistor/Mosfet Testing
• Memory Testing
• RF Component Testing

Material Analysis

• Raman Spectroscopy Testing Services
• SEM & EDS Testing Services
• XRF

Soldering Test

• Wetting Balance Testing Services

Failure Analysis

Tinning Services

• HI-REL Tinning Services

Customer Inventory Management And Monitoring

Wafer bumping

EOL Die Program

• Long Term Die & Wafer Storage

Product Recreation

• Form-Fit-Function Recreation
• Memory Repackaging
• Electrical Performance Recreation

Package, Substrate and Leadframe Replication

• Ability to re-introduce most package technologies
• ROHS/SnPb lead finishes available
• JEDEC and custom package outlines
• Substrate and leadframe design services available
• Qualification services available