EOL DIE Proposal
- Mock Webware
Customer Inventory Management And Monitoring
Wafer bumping
EOL Die Program
- Long Term Die & Wafer Storage
Product Recreation
- Form-Fit-Function Recreation
- Memory Repackaging
- Electrical Performance Recreation
Package, Substrate and Leadframe Replication
- Ability to re-introduce most package technologies
- ROHS/SnPb lead finishes available
- JEDEC and custom package outlines
- Substrate and leadframe design services available
- Qualification services available