• Hermetic Assembly
  • Automated and semi-automated assembly equipment
  • Eutectic, Silver Glass and Epoxy Die Attach
  • Frit, Solder Seal and Metal Can Sealing
  • Package replications including leadframes
  • DLA certified
  • Flexible equipment to handle mix of package types
  • Commercial and Military flows
  • In-house reliability testing
  • Qualification services available
• CSP/Plastic Assembly
  • Automated saw, die attach and wire bond equipment
  • Full automold and semi-automated mold equipment
  • Flexible manufacturing space supporting a range of volumes
  • Leadframe options including: design/replication, pre-plated, spot plated
  • Gold ball bond
  • Epoxy die attach
  • Custom assembly solutions
  • Qualification services available
• Custom Packaging
  • Open Cavity Packaging
• Multi-Chip Modules
• Assembly Services
• Final Test

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• BGA Reballing
• Solder dip options
• SnPb, Matte Sn, and Ni Plating
• Robotic Hot Solder Dip & Exchange
• Pre-plated RoHs frames
• Lead Attach / Component Preparation
• Configurable for other plating solutions
• CGA Attach
• Flexible rack plating system supports plating of leadframes and other electronic components
• Trim & Form and Reconditioning

Assembly Rework Repair Component Harvesting

• Wafer bumping
• Wafer test
• Wafer back-side grind
• Wafer dicing
• Wafer grinding
• Wafer saw
• Die pick and place
• Die inspection

• Long-Term Storage
  • Long-term storage and managed logistics manufacturing programs
  • Lot acceptance and reliability test services to ensure full product functionality
  • Parts management
  • Usage reporting
• Next-Generation Storage
  • ISO-7/10K certified
  • Enhanced ESD controls
  • ISO-5 Inspection areas
  • Relative humidity control
  • Real-time monitoring of temperature and humidity
  • Auto-purge on power fail
  • Secure room and individual cabinets    

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