Packaging Solutions
- Mock Webware
- Hermetic Assembly
- Automated and semi-automated assembly equipment
- Eutectic, Silver Glass and Epoxy Die Attach
- Frit, Solder Seal and Metal Can Sealing
- Package replications including leadframes
- DLA certified
- Flexible equipment to handle mix of package types
- Commercial and Military flows
- In-house reliability testing
- Qualification services available
- CSP/Plastic Assembly
- Automated saw, die attach and wire bond equipment
- Full automold and semi-automated mold equipment
- Flexible manufacturing space supporting a range of volumes
- Leadframe options including: design/replication, pre-plated, spot plated
- Gold ball bond
- Epoxy die attach
- Custom assembly solutions
- Qualification services available
- Custom Packaging
- Open Cavity Packaging
- Multi-Chip Modules
- Assembly Services
- Final Test